Influence of interface in electrical properties of 3D printed structures

The aligned bond interfaces resulting from the layer-by-layer nature of material extrusion-based additive manufacturing (MEAM) leads to anisotropic properties in printed parts. This study examines the anisotropy in electrical impedance and its variation with print parameters. Samples consisting of a stack of filaments are used to study the interfaces, which are the fundamental building block of MEAM, in a controlled manner. Anisotropy was quantified using the ratio of the impedance measured across (Z-specimen) and along (F-specimen) the fiber orientation. Although the conductivity of the material was found to change with extrusion temperature, the Z/F ratio was found to be constant (2.15 ± 0.23), regardless of the variation in thermal conditions imposed by varying extrusion temperature and print speed. By varying the distance over which impedance was measured, impedance scaling was understood. The scaling was found to be dependent on the extrusion temperature regardless of the variation of print speed by 266%; ~12.5 Ω per interface for 190 °C while ~6.5 Ω per interface for 230 °C, one-third of which was found to be contributed by fiber. While studying the cause for significant impedance at the interface, scanning electron microscopy study shows absence of airgaps at the interface, and energy dispersion spectroscopy shows absence of oxidation at the interface. The implications of specimen design and characterization proposed here allows for examination of a wide range of print parameters with reduction in material, time, and cost. Thus, by investigating the role of print parameters and scaling of impedance with interfaces, we seek to provide a framework to model and predict electrical behavior of electric sensors and actuators made with MEAM.