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Texture Evolution and Nanohardness in Cu-Nb Composite Wires.

Shihua Xiang1,2, Xiaofang Yang1,2, Yanxiang Liang1,2

  • 1Shenyang National Laboratory for Materials Science, Chongqing University, Chongqing 400044, China.

Materials (Basel, Switzerland)
|September 28, 2021
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Summary

Researchers studied copper-niobium (Cu-Nb) wires, finding that dynamic recrystallization affects copper matrix texture and grain size. This impacts the wires' mechanical properties at the nanoscale.

Keywords:
Cu-Nb compositedynamic recrystallizationinterfacenanoindentationtexture

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Area of Science:

  • Materials Science
  • Metallurgy
  • Nanotechnology

Background:

  • Multifilamentary microcomposite copper-niobium (Cu-Nb) wires are fabricated using accumulative drawing and bonding (ADB).
  • Understanding the microstructure and texture evolution is crucial for optimizing wire properties.

Purpose of the Study:

  • To investigate the texture evolution of the copper (Cu) matrix in Cu-Nb wires during cold drawing.
  • To correlate microstructural features (grain size, texture) with nanoindentation behavior.

Main Methods:

  • Fabrication of Cu-Nb wires via accumulative drawing and bonding (ADB).
  • Microstructural analysis using electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM).
  • Nanoindentation testing to evaluate mechanical properties.

Main Results:

  • Dynamic recrystallization during cold drawing weakened the <111> texture in the micron-scale Cu matrix at high strains.
  • A sharp <111> texture was observed in the nano-scale Cu matrix due to suppressed dynamic recrystallization.
  • Increased dynamic recrystallization at high strains reduced grain size.

Conclusions:

  • The study establishes a relationship between nanoindentation behavior, grain size, Cu-Nb interface characteristics, and texture in the Cu matrix.
  • Microstructural control through dynamic recrystallization is key to tailoring the properties of Cu-Nb wires.