Batch fabrication and compact integration of customized multispectral filter arrays towards snapshot imaging

Snapshot multispectral imaging (MSI) has been widely employed in the rapid visual inspection by virtues of the non-invasive detection mode and short integration time. As the critical functional elements of snapshot MSI, narrowband, customizable, and pixel-level multispectral filter arrays (MSFAs) that are compatible with imaging sensors are difficult to be efficiently manufactured. Meanwhile, monolithically integrating MSFAs into snapshot multispectral imagers still remains challenging considering the strict alignment precision. Here, we propose a cost-efficient, wafer-level, and customized approach for fabricating transmissive MSFAs based on Fabry-Perot structures, both in the pixel-level and window-tiled configuration, by utilizing the conventional lithography combined with the deposition method. The MSFA chips own a total dimension covering the area of 4.8 mm × 3.6 mm with 4 × 4 bands, possessing the capability to maintain narrow line widths (∼25 nm) across the whole visible frequencies. After the compact integration with the imaging sensor, the MSFAs are validated to be effective in filtering and target identification. Our proposed fabrication method and imaging mode show great potentials to be an alternative to MSFAs production and MSI, by reducing both complexity and cost of manufacturing, while increasing flexibility and customization of imaging system.