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Reducing Kapitza resistance between graphene/water interface via interfacial superlattice structure.

Xiaoyi Peng1, Pengfei Jiang1, Yulou Ouyang1

  • 1Center for Phononics and Thermal Energy Science, China-EU Joint Lab for Nanophononics, School of Physics Science and Engineering, Tongji University, Shanghai 200092, People's Republic of China.

Nanotechnology
|October 13, 2021
PubMed
Summary

Introducing superlattice structures significantly reduces graphene/water Kapitza resistance by up to 40%. This enhancement stems from increased phonon scattering in graphene, not altered water structure, offering insights for thermal interface design.

Keywords:
Kapitza resistancegraphenemolecular dynamics simulationsolid/liquid interfacesuperlattice

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Thermal Physics

Background:

  • Efficient thermal management is crucial for integrated devices.
  • Controlling heat transport across solid/liquid interfaces is a key challenge.
  • Graphene-water interfaces are relevant for thermal interface materials.

Purpose of the Study:

  • To investigate the impact of interfacial superlattice structures on Kapitza resistance.
  • To elucidate the underlying physical mechanisms of heat transfer enhancement.
  • To explore potential strategies for designing advanced thermal interfaces.

Main Methods:

  • Molecular dynamics simulations were employed.
  • Analysis of interfacial structure and atomic vibrations.
  • Spectral energy density and phonon scattering rate calculations.

Main Results:

  • Superlattice structures reduced Kapitza resistance by up to 40%.
  • Kapitza resistance decreased with decreasing superlattice period.
  • Enhanced phonon scattering in the graphene layer was identified as the primary mechanism.
  • Water structure and vibrational spectra showed minor changes.

Conclusions:

  • Interfacial superlattice decoration effectively controls Kapitza resistance.
  • The mechanism involves enhanced phonon scattering within the solid interface layer.
  • This approach offers a novel pathway for designing efficient thermal interfaces.