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Laser-driven programmable non-contact transfer printing of objects onto arbitrary receivers via an active elastomeric
Hongyu Luo1, Chengjun Wang1, Changhong Linghu1
1Department of Engineering Mechanics, Soft Matter Research Center, and Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China.
National Science Review
|October 25, 2021
Summary
This study introduces a laser-driven, non-contact transfer printing method using an active elastomeric stamp for advanced electronics assembly. This technique enables precise, programmable transfer of micro-scale components, crucial for heterogeneous integration in flexible and curvilinear electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Mechanical Engineering
Background:
- Transfer printing is vital for assembling inorganic materials with elastomers in novel electronics.
- Existing methods face challenges in heterogeneous integration and precise component placement.
Purpose of the Study:
- To develop a laser-driven, programmable, non-contact transfer printing technique.
- To demonstrate precise assembly of micro-scale components for advanced electronic applications.
Main Methods:
- Utilized an active elastomeric microstructured stamp with air cavities and a laser-absorbing metal layer.
- Employed local laser heating to dynamically control interfacial adhesion by inflating a micro-patterned surface membrane.
- Investigated fundamental design, fabrication, and operational principles through theoretical and experimental studies.
Main Results:
- Achieved a switchable interfacial adhesion with over three orders of magnitude change via controlled laser heating (<100°C).
- Successfully demonstrated programmable transfer printing of micro-scale silicon platelets and LED chips.
- Showcased deterministic assembly capabilities on challenging receiver substrates.
Conclusions:
- The developed technique offers a robust solution for non-contact, programmable transfer printing.
- Enables heterogeneous integration of diverse materials for applications like curvilinear electronics and MicroLED displays.
- Presents significant engineering opportunities in advanced electronic assembly.
