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3D Printable concentrated liquid metal composite with high thermal conductivity
Sumin Moon1, Hanul Kim1, Kyoungmun Lee1
1Department of Chemical and Biomolecular Engineering and KINC, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Korea.
Iscience
|October 27, 2021
Summary
Researchers developed advanced heat dissipation composites using liquid metal (LM) and hexagonal boron nitride (h-BN). These materials achieve high thermal conductivity (k) and room-temperature processability for 3D printing applications.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Traditional heat dissipation materials face a trade-off between thermal conductivity (k) and processability.
- Achieving high k often requires high filler concentrations, hindering material processing.
Purpose of the Study:
- To overcome the thermal conductivity-processability trade-off in heat dissipation materials.
- To develop novel composites utilizing liquid metal (LM) for enhanced thermal management.
Main Methods:
- Fabrication of heat dissipation composites with varying concentrations of liquid metal (LM) dispersed in a polymer matrix.
- Incorporation of hexagonal boron nitride (h-BN) to further enhance thermal conductivity.
- Evaluation of thermal conductivity (k) and processability, including suitability for 3D printing.
Main Results:
- A 90 vol% LM composite demonstrated a tenfold increase in k compared to a 50 vol% LM composite.
- Introducing h-BN between LM droplets resulted in the highest recorded k of 17.1 W m⁻¹ K⁻¹.
- The developed LM composite exhibits excellent processability at room temperature, suitable for 3D printing inks.
Conclusions:
- The novel LM-based composites successfully overcome the conventional trade-off, offering both high thermal conductivity and excellent processability.
- The materials enable on-demand fabrication of heat dissipation solutions under ambient conditions.
- Increased surface area in the LM composite facilitates rapid heat dissipation, crucial for advanced thermal management.

