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Metal Matrix Composite in Heat Sink Application: Reinforcement, Processing, and Properties
Mirza Murtuza Ali Baig1, Syed Fida Hassan1,2, Nouari Saheb1,2
1Department of Mechanical Engineering, King Fahd University of Petroleum and Minerals, Dhahran 31261, Saudi Arabia.
Materials (Basel, Switzerland)
|November 13, 2021
Summary
Metal matrix composites (MMCs) enhance heat dissipation for electronics. This review details reinforcements, processing, and interfacial bonding for advanced thermal management materials.
Area of Science:
- Materials Science
- Thermal Engineering
- Nanotechnology
Background:
- Miniaturization and increased performance of electronic devices necessitate advanced heat dissipation solutions.
- Traditional heat sink materials struggle to meet demands for high thermal conductivity, low density, and matched thermal expansion.
- Metal matrix composites (MMCs) offer tailored properties for improved thermal management.
Purpose of the Study:
- To comprehensively review advancements in metal matrix composites for enhanced thermal performance.
- To analyze the impact of various reinforcements and processing techniques on MMC thermal properties.
- To emphasize the critical role of interfacial bonding in optimizing thermal conductivity.
Main Methods:
- Literature review of studies on metal matrix composites for thermal management.
- Analysis of different metallic matrices and reinforcement types (e.g., ceramics, carbon materials).
- Evaluation of processing techniques (e.g., casting, powder metallurgy) and their effect on composite microstructure and properties.
Main Results:
- Various reinforcements significantly enhance the thermal conductivity of metallic matrices.
- Optimizing reinforcement size, type, volume fraction, and distribution is crucial for performance.
- Effective interfacial bonding between matrix and reinforcement is key to maximizing thermal transport.
Conclusions:
- Metal matrix composites are a promising class of materials for next-generation heat sinks.
- Careful selection of matrix, reinforcement, and processing methods, alongside improved interfacial bonding, can yield superior thermal performance.
- Further research into interfacial engineering is vital for unlocking the full potential of MMCs in thermal management.
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