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New copolyimide (CPI) films featuring a rigid fluorene structure offer reduced dielectric permittivity and enhanced hydrophobicity. These advanced materials are ideal for microelectronic and insulation applications due to their excellent thermal stability and mechanical strength.

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Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Electrical Engineering

Background:

  • Miniaturization in electronics necessitates low-permittivity interlayer materials to mitigate crosstalk and signal loss.
  • Copolyimides (CPIs) are explored for their potential in advanced electronic applications.

Purpose of the Study:

  • To develop novel copolyimide (CPI) films with reduced dielectric permittivity and improved properties.
  • To investigate the effect of a rigid conjugated fluorene structure on CPI film characteristics.

Main Methods:

  • In situ polymerization was employed to fabricate CPI films.
  • 9,9-Bis(3-fluoro-4-aminophenyl) fluorene was used as a rigid conjugated monomer.
  • Molecular weight and conjugated structure fraction were varied.

Main Results:

  • CPI films with a fluorene rigid conjugated structure were successfully synthesized.
  • Dielectric permittivity was reduced, reaching as low as 2.53 at 10^6 Hz.
  • Excellent thermal stability (Td5% up to 530 °C) and high tensile strength (≥ 96 MPa) were achieved.
  • Improved hydrophobicity was observed with increased conjugated structure fraction.

Conclusions:

  • The developed CPI films exhibit a desirable combination of low dielectric permittivity, high thermal stability, and mechanical strength.
  • These CPI films are promising candidates for advanced dielectric materials in microelectronic and insulation applications.