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Three-dimensional wavelength-division multiplexing interconnects based on a low-loss Si_xN_y arrayed waveguide grating.

Jaegyu Park, Jiho Joo, Myung-Joon Kwack

|November 23, 2021

Summary

Researchers developed three-dimensional wavelength-division multiplexing (3D-WDM) interconnects using silicon nitride layers. This CMOS-compatible fabrication enables efficient optical signal routing with low loss and crosstalk.

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Area of Science:

Photonics
Materials Science
Electrical Engineering

Background:

Advanced optical interconnects are crucial for high-performance computing and data centers.
Existing solutions often face challenges in scalability, integration, and signal integrity.

Purpose of the Study:

To fabricate and characterize novel three-dimensional wavelength-division multiplexing (3D-WDM) interconnects.
To demonstrate a CMOS-compatible process for creating integrated optical circuits.

Main Methods:

Fabrication of three-dimensional interconnects using three Si_xN_y layers.
Integration of Si_xN_y grating couplers for optical signal input.
Utilizing a Si_xN_y array waveguide grating (AWG) for signal demultiplexing.
Employing SiO_xN_y interlayer couplers for vertical signal transfer between layers.

Main Results:

Achieved low insertion loss and low crosstalk in the array waveguide grating (AWG).
Measured coupling losses of approximately 1.52 dB for SiO_xN_y interlayer couplers.
Measured coupling losses of approximately 4.2 dB for the Si_xN_y grating coupler.

Conclusions:

The developed 3D-WDM interconnects offer a promising solution for integrated photonics.
The CMOS-compatible fabrication process facilitates scalable manufacturing.
The demonstrated low loss and crosstalk performance are suitable for advanced optical communication systems.