Material innovation and mechanics design for substrates and encapsulation of flexible electronics: a review

Haibo Li1, Yinji Ma, Yonggang Huang

  • 1Department of Engineering Mechanics, Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, China. mayinji@tsinghua.edu.cn.

Materials Horizons
|November 25, 2021
PubMed

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