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Millefeuille-Inspired Thermal Interface Materials based on Double Self-Assembly Technique for Efficient
Yueyang Gao1, Di Bao2, Minghang Zhang1
1State Key Laboratory of Chemical Engineering, Collaborative Innovation Centre of Chemical Science and Engineering, Department of Chemical Engineering and Technology, Tianjin University, Tianjin, 300350, China.
Small (Weinheim an Der Bergstrasse, Germany)
|November 29, 2021
Summary
This study introduces a novel double self-assembly method for creating flexible thermal interface materials (TIMs) with excellent thermal conductivity and electromagnetic interference (EMI) shielding. These advanced TIMs offer superior performance for next-generation electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Miniaturized and high-frequency electronics require flexible thermal interface materials (TIMs) with electromagnetic interference (EMI) shielding.
- Carbon-based TIMs offer high thermal conductivity (TC) but face production challenges like defects and interfacial resistance.
- Existing TIMs struggle to balance thermal management and EMI shielding effectively.
Purpose of the Study:
- To develop a novel fabrication strategy for high-performance TIMs.
- To achieve both ultrahigh thermal conductivity and superior EMI shielding in a single material.
- To address limitations in current carbon-based TIM production and performance.
Main Methods:
- A unique double self-assembly strategy inspired by millefeuille cake structure.
- Fabrication of TIMs with a percolating and oriented multilayered microstructure.
- Characterization of in-plane thermal conductivity and EMI shielding effectiveness.
Main Results:
- Achieved an ultrahigh in-plane TC of 233.67 W m⁻¹ K⁻¹.
- Demonstrated outstanding EMI shielding effectiveness of 79.0 dB at 12.4 GHz.
- Observed a significant temperature decrease of nearly 45 °C compared to commercial materials.
Conclusions:
- The developed TIM successfully balances thermal conduction and EMI shielding.
- The unique microstructure enables exceptional performance.
- This material shows significant potential for military applications and advanced thermal management systems.
