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Hierarchically Multifunctional Polyimide Composite Films with Strongly Enhanced Thermal Conductivity
Yongqiang Guo1, Hua Qiu2, Kunpeng Ruan1
1Shaanxi Key Laboratory of Macromolecular Science and Technology, School of Chemistry and Chemical Engineering, Northwestern Polytechnical University, Xi'an, 710072, Shaanxi, People's Republic of China.
Nano-Micro Letters
|December 10, 2021
Summary
New polyimide composite films offer high thermal conductivity and electromagnetic interference shielding for electronics. These flexible films provide enhanced heat dissipation and radiation protection, crucial for advanced electronic applications.
Area of Science:
- Materials Science
- Polymer Science
- Nanotechnology
Background:
- Flexible films with high thermal conductivity and electromagnetic interference (EMI) shielding are essential for modern electronics to manage heat and radiation.
- Polyimide (PI) based composites are promising candidates due to their inherent properties.
Purpose of the Study:
- To develop hierarchically multifunctional polyimide composite films with enhanced thermal conductivity and EMI shielding.
- To improve mechanical properties and electric-heating response for electronic applications.
Main Methods:
- Fabrication of polyimide composite films using a hierarchical design and assembly strategy.
- Incorporation of graphene oxide/expanded graphite (GO/EG) for thermal conductivity and EMI shielding.
- Integration of Fe3O4/polyimide (Fe3O4/PI) for enhanced EMI shielding.
- Utilizing electrospun PI fibers as a substrate for mechanical reinforcement.
Main Results:
- Achieved high in-plane thermal conductivity coefficient of 95.40 W/(m·K).
- Demonstrated excellent EMI shielding effectiveness of 34.0 dB.
- Obtained good tensile strength of 93.6 MPa.
- Exhibited a fast electric-heating response within 5 seconds.
Conclusions:
- The developed polyimide composite films possess a unique hierarchical structure enabling multifunctional properties.
- These films show significant potential for applications in flexible electronics, addressing thermal management and electromagnetic compatibility challenges.
