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Updated: Oct 9, 2025

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Solvent Bonding for Fabrication of PMMA and COP Microfluidic Devices

Published on: January 17, 2017

Direct gold bonding for flexible integrated electronics.

Masahito Takakuwa^1,2, Kenjiro Fukuda^2,3, Tomoyuki Yokota⁴

¹Department of Modern Mechanical Engineering, Waseda University, 3-4-1 Okubo, Shinjuku-ku, Tokyo 169-8555, Japan.

Science Advances

|December 22, 2021

Summary

This summary is machine-generated.

Water vapor plasma–assisted bonding (WVPAB) enables direct, low-temperature connection of gold electrodes for flexible electronics. This method creates stable interconnections without adhesives, crucial for wearable devices.

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Area of Science:

Materials Science
Electronics Engineering
Surface Science

Background:

Flexible and wearable electronics require stable, conductive interconnections.
Current methods often use adhesives, compromising flexibility and requiring high temperatures.
Achieving metal-like conductivity and low stiffness simultaneously is challenging.

Purpose of the Study:

To develop a novel, low-temperature bonding method for direct interconnection of gold electrodes.
To enable the fabrication of stable and flexible electronic systems.
To overcome limitations of conventional bonding techniques.

Main Methods:

Water vapor plasma–assisted bonding (WVPAB) was developed and characterized.
Direct bonding of gold electrodes on ultrathin polymer films was achieved.
Room temperature and atmospheric pressure conditions in ambient air were utilized.

Main Results:

WVPAB successfully bonded rough gold electrodes directly.
Strong and stable interfaces were formed via hydroxyl groups generated by plasma.
Ultrathin wiring films were used to interconnect ultraflexible organic photovoltaics and light-emitting diodes.

Conclusions:

WVPAB offers a promising solution for creating flexible and stable interconnections.
The technique is suitable for low-temperature processing of delicate electronic devices.
This method advances the development of next-generation wearable and conformable electronics.