Temperature-dependent electronic structure of γ-phase CuI: first-principles insights
Ze-Li Xu1, Chang Yang1, Yu-Ning Wu1
1Key Laboratory of Polar Materials and Devices (MOE) and Department of Electronics, East China Normal University, Shanghai 200241, People's Republic of China.
Copper iodide (CuI) exhibits a unique bandgap widening with increasing temperature, unlike most semiconductors. This research explores temperature effects on CuI
Area of Science:
- Materials Science
- Condensed Matter Physics
- Solid State Chemistry
Background:
- Copper iodide (CuI) is a promising material for next-generation transparent displays.
- Understanding its electronic properties under varying temperatures is crucial for device optimization.
Purpose of the Study:
- To investigate the temperature-dependent electronic structures of the room-temperature phase of CuI (γ-CuI).
- To elucidate the contributions of electron-phonon interaction and thermal expansion to bandgap changes.
- To evaluate the impact of temperature on hole mobility in CuI.
Main Methods:
- Density-functional-theory (DFT)-based calculations.
- Analysis of bandgap renormalization due to electron-phonon (el-ph) coupling and lattice expansion.
- Application of the Drude model to assess temperature-dependent effective masses and hole mobilities.
Main Results:
- The bandgap of CuI widens with increasing temperature, a behavior contrary to most semiconductors.
- Bandgap widening was quantified as 88.3 meV across a temperature range of 0–600 K.
- Calculated hole mobilities, considering phonon scattering, show good agreement with experimental data.
Conclusions:
- The study provides fundamental insights into the temperature effects on CuI's electronic structure.
- Findings offer guidance for enhancing the performance of electronic and thermoelectric devices utilizing CuI.
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