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Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

Karel Dušek1, Petr Veselý1, David Bušek1

  • 1Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, 16627 Prague, Czech Republic.

Materials (Basel, Switzerland)
|December 24, 2021
PubMed

Keywords:
SAC solder alloyreflow solderingsolder fluxsolder masksurface finish

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