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Adhesion Optimization between Incompatible Polymers through Interfacial Engineering.

Fatemeh Mashayekhi1,2, Julien Bardon1, Stephan Westermann1

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Improving 3D-printed structural health monitoring requires strong adhesion between polyimide (PI) jackets and poly(lactic acid) (PLA) parts. Mechanical abrasion and polydopamine coating significantly enhance PI-PLA bonding for better sensor integration.

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adhesioninterfacial engineeringpolyimidepolylactidesurface characterization

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Area of Science:

  • Materials Science
  • Polymer Science
  • Additive Manufacturing

Background:

  • Additive manufacturing (AM) enables integrated structural health monitoring (SHM) in 3D-printed parts.
  • Embedding Fiber Bragg Grating (FBG) sensors in polymers for SHM requires optimal adhesion between the sensor jacket and the printed material.
  • Polyimide (PI) and poly(lactic acid) (PLA) are incompatible polymers often used in FBG sensors and 3D printing, respectively.

Purpose of the Study:

  • To investigate surface treatment methods for enhancing adhesion between PI films and PLA substrates.
  • To determine the most effective method for promoting interfacial bonding for FBG sensor integration in 3D-printed parts.

Main Methods:

  • Investigated surface treatments on PI films including cleaning, plasma activation, roughness modification (mechanical abrasion), and nanocoating (polydopamine).
  • Fabricated PI-PLA bilayer samples by welding PLA onto treated PI surfaces.
  • Quantified adhesion strength using peel testing.

Main Results:

  • Surface treatments significantly influenced PI-PLA adhesion.
  • A combination of mechanical abrasion (to increase roughness) and polydopamine coating yielded the highest adhesion.
  • Synergistic effects between mechanical interlocking and chemical interactions were observed.

Conclusions:

  • Effective surface modification strategies are crucial for successful integration of FBG sensors into 3D-printed structures.
  • The combined approach of mechanical abrasion and polydopamine coating offers a promising solution for robust PI-PLA bonding.
  • This enhanced adhesion is vital for reliable strain and temperature measurements in FFF-based SHM applications.