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Molecular Dynamics Simulation of Cracking Process of Bisphenol F Epoxy Resin under High-Energy Particle Impact
Yunqi Xing1,2, Yuanyuan Chen1,2, Jiakai Chi1,2
1State Key Laboratory of Reliability and Intelligence of Electrical Equipment, Hebei University of Technology, Tianjin 300401, China.
Abstract:
The current lead insulation of high-temperature superconductivity equipment is under the combined action of large temperature gradient field and strong electric field. Compared with a uniform temperature field, its electric field distortion is more serious, and it is easy to induce surface discharge to generate high-energy particles, destroy the insulation surface structure and accelerate insulation degradation. In this paper, the degradation reaction process of bisphenol F epoxy resin under the impact of high-energy particles, such as O3, HO, H3O and NO, is calculated based on ReaxFF simulation. According to the different types of high-energy particles under different voltage polarities, the micro-degradation mechanism, pyrolysis degree and pyrolysis products of epoxy resin are analyzed. The results show that in addition to the chemical reaction of high-energy particles with epoxy resin, their kinetic energy will also destroy the molecular structure of the material, causing the cross-linked epoxy resin to pyrolyze, and the impact of positive particles has a more obvious impact on the pyrolysis of epoxy resin.
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