Related Experiment Video
Updated: Oct 8, 2025

The Effect of Anodization Parameters on the Aluminum Oxide Dielectric Layer of Thin-Film Transistors
Published on: May 24, 2020
Cation Composition-Dependent Device Performance and Positive Bias Instability of Self-Aligned Oxide Semiconductor
Jun Tae Jang1, Donguk Kim1, Ju Heyuck Baeck2
1School of Electrical Engineering, Kookmin University, Seoul 02707, Republic of Korea.
Abstract:
Amorphous oxide semiconductor transistors control the illuminance of pixels in an ecosystem of displays from large-screen TVs to wearable devices. To satisfy application-specific requirements, oxide semiconductor transistors of various cation compositions have been explored. However, a comprehensive study has not been carried out where the influence of cation composition, oxygen, and hydrogen on device characteristics and stability is systematically quantified, using commercial-grade process technology. In this study, we fabricate self-aligned top-gate structure thin-film transistors with three oxide semiconductor materials, InGaZnO (In/Ga/Zn = 1:1:1), In-rich InGaZnO, and InZnO, having mobility values of 10, 27, and 40 cm2/V·s, respectively. Combinations of varied amounts of oxygen and hydrogen are incorporated into each transistor by controlling the fabrication process to study the effect of these gaseous elements on the physical nature of the channel material. Electrons can be captured by peroxy linkage (O22-) or undercoordinated In (In* to become In+), which are manifested in the extracted subgap density-of-states profile and first-principles calculations. Energy difference between electron-trapped In+ and O22- σ* is the smallest for IGZO, and In+-O22- annihilation occurs by electron excitation from the subgap In+ state to the O22- σ*. Furthermore, characteristic time constants during positive bias stress and recovery reveal the various microscopic physical phenomena within the transistor structure between different cation compositions.
Related Concept Videos
Biasing of Metal-Semiconductor Junctions
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
Biasing of FET
In an N-channel JFET, the structure consists of N-type material forming the channel on a P-type substrate, with the...
Metal-Semiconductor Junctions
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
Characteristics of MOSFET
Various vital parameters influence their functionality, which is crucial for theory and electronics applications. First, channel dimensions, precisely length, and width, are pivotal. The size of these channels affects the transistor's ability to carry current and switching speeds; shorter channels typically enable...
MOSFET
In an n-MOSFET, the structure includes n-type source and drain...
MOS Capacitor
The metal gate is typically made from highly conductive materials such as aluminum or polysilicon. Beneath the metal gate lies a thin layer of...

