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Updated: Oct 7, 2025

Planar and Three-Dimensional Printing of Conductive Inks
Published on: December 9, 2011
Pickering emulgels reinforced with host-guest supramolecular inclusion complexes for high fidelity direct ink writing
Bo Pang1, Rubina Ajdary2, Markus Antonietti1
1Department of Colloid Chemistry, Max Planck Institute of Colloids and Interfaces, Potsdam 14476, Germany. svitlana.filonenko@mpikg.mpg.de.
Abstract:
Direct ink writing (DIW) of Pickering emulsions offers great potential for constructing on-demand objects. However, the rheological properties of fluid emulsions greatly undermines the shape fidelity and structural integrity of 3D-printed structures. We solve here these challenges and realize a new route towards complex constructs for actual deployment. A dynamic, supramolecular host-guest hydrogel based on poly(ethylene glycol) and α-cyclodextrin was synthesized in the continuous phase of cellulose nanocrystal-stabilized Pickering emulsions. The storage modulus of the obtained emulgels could reach up to ∼113 kPa, while being shear thinning and yielding precise printability. Diverse complex architectures were possible with high shape fidelity and structural integrity. The printed objects, for example a double-wall cylinder with 75 layers, demonstrated excellent dimensional stability (shrinkage of 7 ± 2% after freeze-drying). With the merits of a simple fabrication process and the high biocompatibility of all the components, the concept of dynamic supramolecular hydrogel-reinforced emulgels represent a potentially versatile route to construct new materials and structures VIA DIW for use in bioproducts and biomedical devices.

