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Study on the Strip Warpage Issues Encountered in the Flip-Chip Process.
Wan-Chun Chuang1, Wei-Long Chen1
1Department of Mechanical and Electromechanical Engineering, Engineering Technology Research & Promotion Center, National Sun Yat-sen University, Kaohsiung 804, Taiwan.
Materials (Basel, Switzerland)
|January 11, 2022
Summary
A new simulation model accurately predicts flip-chip process strip warpage. Key factors like die and substrate thickness were identified, leading to design guidelines for thinner, more reliable semiconductor chips.
Area of Science:
- Materials Science
- Manufacturing Engineering
- Semiconductor Processing
Background:
- Flip-chip technology is crucial for modern electronics.
- Minimizing strip warpage is essential for high-yield semiconductor manufacturing.
- Existing models may not fully capture the complex interactions influencing warpage.
Purpose of the Study:
- To develop and validate a strip warpage simulation model for the flip-chip process.
- To investigate the impact of structural design and process parameters on strip warpage.
- To propose design guidelines for reducing strip warpage and overall thickness.
Main Methods:
- Established a strip warpage simulation model.
- Investigated effects of molding, curing, pretreatment, and ball mounting.
- Employed Taguchi analysis to identify key influencing factors.
- Validated simulation results against experimental data (error < 8%).
Main Results:
- Die thickness and substrate thickness were the primary factors affecting strip warpage.
- Mold compound thickness and molding temperature also significantly influenced warpage.
- Proposed design criteria, locating the neutral axis on the bump, effectively reduced both warpage and strip thickness.
Conclusions:
- The developed simulation model accurately predicts strip warpage.
- The study provides actionable design guidelines for optimizing strip structure and process parameters.
- These guidelines support the production of lighter, thinner semiconductor chips, accelerating development and reducing costs.
