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Direct Laser Interference Ink Printing Using Copper Metal-Organic Decomposition Ink for Nanofabrication
Jun-Han Park1, Jung-Woon Lee1, Yong-Won Ma2,3
1Department of Cogno-Mechatronics Engineering, Pusan National University, Busan 46241, Korea.
Nanomaterials (Basel, Switzerland)
|February 15, 2022
Summary
We developed direct laser interference ink printing (DLIIP) for rapid nanoscale copper printing. This effective method achieves fine 500 nm copper patterns with excellent electrical properties in ambient conditions.
Area of Science:
- Materials Science
- Nanotechnology
- Additive Manufacturing
Background:
- Precise nanoscale fabrication is crucial for advanced electronics.
- Existing methods for nanoscale printing often require complex environments or post-processing.
Purpose of the Study:
- To develop an effective and rapid nanoscale ink printing process.
- To demonstrate the feasibility of direct laser interference ink printing (DLIIP) for copper.
- To achieve high-resolution copper patterns with desirable electrical properties.
Main Methods:
- Utilized a copper-based metal-organic decomposition ink.
- Employed direct laser interference ink printing (DLIIP) leveraging photothermal reactions.
- Fabricated nanoscale copper patterns under ambient conditions without pre- or post-processing.
Main Results:
- Successfully printed periodically lined copper patterns with a 500 nm width.
- Achieved a fabrication speed of 17 mm/s on a 240 μm line.
- Obtained a resistivity of 3.5 μΩ∙cm for the printed copper pattern.
- Observed a low oxidation state in the printed copper, twice that of bulk copper.
Conclusions:
- DLIIP is a feasible and rapid technique for nanoscale copper printing.
- The process enables the creation of fine copper patterns with excellent electrical characteristics.
- The ambient and processing-free nature of DLIIP offers significant advantages for microfabrication.
