Effect of external electric field on ultraviolet-induced nanoparticle colloid jet machining

Electric field enhanced ultraviolet (UV)-induced nanoparticle colloid jet machining is proposed to improve the material removal efficiency of UV-induced nanoparticle colloid jet machining by applying an external electric field. The influences of TiO₂nanoparticle concentration, applied electric field voltage and pH value for the photocatalytic activity of the polishing slurry was investigated by orthogonal experiments. Terephthalic acid (TPA) was used as a fluorescent molecular probe to reflect the relative concentration of hydroxyl radical groups (·OH) in polishing slurry, which directly affects the material removal rate in the UV-induced nanoparticle colloid jet machining process. Scanning electron microscopy (SEM), Fourier-transform infrared spectroscopy (FT-IR), and x-ray photoelectron spectroscopy (XPS) were employed to inspect the interaction variations between the TiO₂nanoparticles and the SiC workpiece surface. The SEM and XPS results exhibit that the external electric field can enhance the adsorption of TiO₂nanoparticles on the SiC workpiece surface, which can create more interfacial reaction active centers in the polishing process. The FT-IR spectra results indicate that TiO₂nanoparticles were chemically bonded to the SiC surface by oxygen-bridging atoms in Ti-O-Si bonds. The results of fixed-point polishing experiment show that due to the enhancement effect of external electric field on the photocatalytic activity of the polishing slurry, the material removal efficiency of electric field enhanced UV-induced nanoparticle colloid jet machining is 15% higher than that of UV-induced nanoparticle colloid jet machining, and is 28% higher than that of pure nanoparticle colloid jet machining. Atomic force microscope micromorphology show that an ultra-smooth SiC workpieces with surface roughness of Rms 0.84 nm (Ra 0.474 nm) has been obtained by electric field enhanced UV-induced nanoparticle colloid jet machining.