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Updated: Oct 3, 2025

Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
Characterization of phonon thermal transport of Ti3C2TMXene thin film
Hao Wu1, Jiaxin Gu1, Zhongcheng Li1
1Key Laboratory of Hydraulic Machinery Transients (MOE), School of Power and Mechanical Engineering, Wuhan University, Wuhan, Hubei, 430072, People's Republic of China.
Abstract:
Two-dimensional MXene materials with high electrotonic conductivity, good chemical stability, and unique laminar structure show great potential in the field of electrochemistry. In contrast to the widely concerned electrical properties, studies on the thermal properties of MXene materials are very limited. This paper presents a comprehensive analysis of the thermal properties of Ti3C2TMXene thin film. Thermal diffusivity and thermal conductivity of Ti3C2Tfilms are characterized by the transient electro-thermal technique. The experimental results show a 16% enhancement in thermal conductivity when the temperature is increased from 307 K to 352 K. The phonon transport contributes substantially to thermal conductivity compared with electron transport. Molecular dynamic simulation is employed to further investigate the role of phonon thermal transport of Ti3C2layer. It is found that the combined effect of specific heat capacity, stacking structure and internal stress states is responsible for the thermal transport performance of Ti3C2TMXene thin film.
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