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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages
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Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

Mohd Izrul Izwan Ramli1,2, Mohd Arif Anuar Mohd Salleh1,2, Mohd Mustafa Al Bakri Abdullah1,2

  • 1Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis (UniMAP), Kangar 02600, Malaysia.

Materials (Basel, Switzerland)
|February 25, 2022
PubMed

Keywords:
alloyingintermetallic compoundsolder alloysurface finish

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