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A Thermopile Infrared Sensor Array Pixel Monolithically Integrated with an NMOS Switch.

Hongbo Li1,2, Chenchen Zhang1, Gaobo Xu1,2

  • 1Institute of Microelectronics of Chinese Academy of Sciences, Beijing 100029, China.

Micromachines
|February 25, 2022
PubMed
Summary
This summary is machine-generated.

We developed a low-cost, high-performance thermopile infrared sensor array (TISA) pixel using a CMOS-compatible monolithic integration process. This novel design integrates a dual-layer polysilicon thermopile with an NMOS switch for efficient infrared detection and signal control.

Keywords:
NMOS switchdual-layer p+/n- poly-Siinterleaved MEMS and CMOS processingmonolithic integrationthermopile infrared sensor array (TISA) pixel

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Area of Science:

  • Materials Science and Engineering
  • Electrical Engineering
  • Sensor Technology

Background:

  • Traditional infrared sensor fabrication often involves complex 3D integration methods, posing significant challenges.
  • Developing cost-effective and high-performance infrared sensing solutions is crucial for various applications.

Purpose of the Study:

  • To design, fabricate, and characterize a novel thermopile infrared sensor array (TISA) pixel.
  • To demonstrate a CMOS-compatible monolithic integration process for simultaneous fabrication of thermopile and NMOS switch.
  • To evaluate the performance benefits of integrating a thermopile with an NMOS switch.

Main Methods:

  • Utilized a CMOS-compatible monolithic integration process involving deposition, etching, lithography, and ion implantation.
  • Fabricated a dual-layer p+/n- poly-Si thermopile with a closed membrane integrated with an n-channel metal oxide semiconductor (NMOS) switch.
  • Characterized the thermopile's thermoelectric properties and the NMOS switch's functionality.

Main Results:

  • Achieved simultaneous fabrication of high-performance thermopile and functional NMOS switch.
  • Demonstrated that the integrated thermopile exhibits a quick response, high sensitivity, and high reliability compared to separate thermopiles.
  • Verified effective and rapid control of thermopile signal readout via the NMOS switch's gate voltage.

Conclusions:

  • The monolithic CMOS-compatible integration approach yields a low-cost, high-performance TISA pixel.
  • This integrated TISA pixel is suitable for high-volume production in array formats.
  • The developed sensor technology offers significant advantages for infrared sensing applications.