Extraction of Interface-Trap Densities of the Stacked Bonding Structure in 3D Integration Using High-Frequency

Man Li1,2, Yufeng Guo1,2, Jiafei Yao1,2

  • 1College of Electronic and Optical Engineering and College of Microelectronics, Nanjing University of Posts and Telecommunications, Nanjing 210023, China.

Micromachines
|February 25, 2022
PubMed

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