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Inductively Coupled Plasma Atomic Emission Spectroscopy: Instrumentation01:26

Inductively Coupled Plasma Atomic Emission Spectroscopy: Instrumentation

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Inductively coupled plasma (ICP) is the common plasma source used in atomic emission spectroscopy (AES), a technique that detects and analyzes various elements in a sample. This method is often called inductively coupled plasma atomic emission spectroscopy (ICP-AES).
There are three main types of inductively coupled plasma atomic emission spectroscopy  (ICP-AES) instruments: sequential, simultaneous multichannel, and Fourier transform instruments, with the latter being less commonly used....
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Related Experiment Video

Updated: Oct 2, 2025

Synthesis and Operation of Fluorescent-core Microcavities for Refractometric Sensing
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Resonant cavity-enhanced photodiode array for miniaturised spectroscopic sensing.

Andrew Bainbridge, Laura A Hanks, Adam P Craig

    Optics Express
    |February 25, 2022
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    Summary

    This study presents a chip-scale hyperspectral sensor using an array of resonant cavity-enhanced photodiodes. This novel approach achieves accurate light wavelength determination, overcoming miniaturization challenges in optical spectroscopic sensing.

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    Area of Science:

    • Optical spectroscopy
    • Photonic sensing technologies
    • Semiconductor device physics

    Background:

    • Optical spectroscopic sensing is crucial for analyzing diverse substances.
    • Miniaturizing traditional spectrometers (Fourier transform, dispersive) often leads to performance degradation.
    • Existing miniaturization attempts face significant design challenges.

    Purpose of the Study:

    • To develop a chip-scale free-space hyperspectral sensing system.
    • To overcome the limitations of miniaturized spectrometers.
    • To enable compact and high-performance optical sensing.

    Main Methods:

    • Fabrication of a linear array of resonant cavity-enhanced photodiodes.
    • Implementation of spatially chirped resonance wavelengths across the array.
    • Tuning spectral band sensitivity by adjusting heterostructure thicknesses.
    • Utilizing graded thicknesses across the wafer for multi-band sensing.

    Main Results:

    • Demonstration of chip-scale free-space hyperspectral sensing.
    • Resonant cavity-enhanced photodiodes successfully sensed narrow spectral bands.
    • Fabricated array determined incident light wavelength with ± 2 nm accuracy.
    • Successful multi-band sensing achieved on a single chip.

    Conclusions:

    • The developed array offers a viable solution for miniaturized hyperspectral sensing.
    • This technology provides accurate wavelength determination for optical spectroscopic sensing.
    • The chip-scale design overcomes miniaturization challenges in spectrometer development.