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Sequential Infiltration Synthesis into Maltoheptaose and Poly(styrene): Implications for Sub-10 nm Pattern Transfer
Anette Löfstrand1, Alexei Vorobiev2, Muhammad Mumtaz3
1NanoLund and Solid State Physics, Lund University, SE-221 00 Lund, Sweden.
Polymers
|February 26, 2022
Summary
Optimizing vapor phase infiltration of trimethyl aluminum and water into carbohydrate-based block copolymers enhances etch selectivity for sub-10 nm pattern transfer. This method successfully demonstrated 12 nm pitch pattern transfer, crucial for advanced semiconductor manufacturing.
Area of Science:
- Materials Science
- Nanotechnology
- Chemical Engineering
Background:
- Block copolymers (BCP) are used for pattern transfer via vapor phase infiltration.
- Carbohydrate-based high-χ BCPs enable sub-10 nm feature pattern transfer.
- Optimizing infiltrated material improves etch selectivity.
Purpose of the Study:
- Investigate semi-static sequential infiltration synthesis (SIS) of TMA and water into MH and PS-OH films.
- Optimize process parameters (temperature, pulse duration, exposure length) for SIS.
- Enhance etch selectivity for sub-10 nm pattern transfer using carbohydrate-based etch masks.
Main Methods:
- Sequential infiltration synthesis (SIS) of trimethyl aluminum (TMA) and water.
- Varying process parameters: temperature (64-100 °C), precursor pulse duration (10-75 ms TMA, 5-45 ms water), and exposure length (20-100 s).
- Characterization of infiltrated Al2O3 in maltoheptaose (MH) films.
Main Results:
- Decreasing exposure time from 100 to 20 s increased Al2O3 volume from 2% to 40% in MH, reducing infiltration depth.
- Temperature minimally affected infiltration degree between 64-100 °C.
- Both shorter (10 ms TMA/5 ms water) and longer (75 ms TMA/45 ms water) precursor pulses yielded 40% Al2O3 in MH.
- Demonstrated 12 nm pitch pattern transfer into silicon.
Conclusions:
- Optimized SIS parameters significantly increase alumina content in carbohydrate-based BCPs.
- Achieved high etch selectivity for sub-10 nm pattern transfer.
- Results advance understanding of SIS mechanisms and carbohydrate-based etch masks for nanoscale fabrication, relevant to the semiconductor industry.

