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Updated: Oct 2, 2025

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Direct optical wire bonding through open-to-air polymerization for silicon photonic chips: publisher's note

Hyun-Woo Rhee, Joonsup Shim, Jae-Yong Kim

|March 1, 2022

Abstract:

This publisher's note contains a correction to Opt. Lett. 47, 714 (2022).

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