Related Experiment Video
Updated: Oct 1, 2025
61:34
Microfabricated Post-Array-Detectors mPADs: an Approach to Isolate Mechanical Forces
Published on: October 1, 2007
12.6K
Chipless RFID Tags as Microwave Sensors for Delamination Detection in Layered Structures
Katelyn Brinker1, Reza Zoughi1
1Department of Electrical and Computer Engineering (ECpE), Center for Nondestructive Evaluation (CNDE), Iowa State University Ames, Iowa 50011, USA.
... IEEE International Instrumentation and Measurement Technology Conference. IEEE International Instrumentation and Measurement Technology Conference
|March 3, 2022
Summary
Chipless radio frequency identification (RFID) tags offer a novel method for detecting defects like delaminations in multilayer dielectric structures. This research optimizes tag design and operating parameters for improved defect sensing capabilities.
Area of Science:
- Materials Science
- Electrical Engineering
- Non-Destructive Testing
Background:
- Monitoring defects such as disbonds and delaminations in multilayer dielectric structures is critical for various applications.
- Traditional monitoring methods face limitations in detecting subtle defects within complex structures.
- Chipless radio frequency identification (RFID) tags present a promising alternative for in-situ defect detection.
Purpose of the Study:
- To investigate the efficacy of chipless RFID tags for monitoring defects in multilayer dielectric structures.
- To analyze the influence of key parameters (tag frequency, material properties, delamination thickness) on sensing performance.
- To evaluate the practical benefits and challenges of employing chipless RFID for defect detection.
Main Methods:
- Utilized electromagnetic simulations to model tag performance and defect interaction.
- Conducted experimental measurements using two novel chipless RFID tag designs.
- Systematically varied operating frequency, material dielectric properties, and delamination thickness in simulations and experiments.
Main Results:
- Demonstrated that chipless RFID tags can effectively detect delaminations and disbonds.
- Identified optimal tag operating frequencies and material configurations for enhanced sensitivity.
- Quantified the impact of delamination thickness on the RFID signal response.
Conclusions:
- Chipless RFID technology shows significant potential for non-destructive evaluation of multilayer dielectric structures.
- Careful selection of tag design and operating parameters is crucial for maximizing sensing capabilities.
- Further research is needed to address challenges related to tag integration and signal interpretation in complex environments.
