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Related Concept Videos

Electronic Distance Measuring Instruments01:30

Electronic Distance Measuring Instruments

771
Electronic Distance Measuring Instruments (EDMs) are essential tools in modern surveying, offering precise distance measurements by emitting electromagnetic signals and calculating the time required for these signals to travel to a target and return. Two primary types of signals are used in EDMs — light waves and microwaves — each suited to specific environmental and distance requirements. Light-wave-based EDMs utilize either infrared or laser light, providing high accuracy over...
771

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Related Experiment Video

Updated: May 2, 2026

Lensfree On-chip Tomographic Microscopy Employing Multi-angle Illumination and Pixel Super-resolution
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A large-scale microelectromechanical-systems-based silicon photonics LiDAR.

Xiaosheng Zhang1, Kyungmok Kwon1, Johannes Henriksson1

  • 1Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, Berkeley, CA, USA.

Nature
|March 10, 2022
PubMed
Summary
This summary is machine-generated.

This study introduces a 16,384-pixel solid-state LiDAR using a focal plane switch array (FPSA) for high-resolution 3D imaging. This advancement promises compact, high-performance sensors for autonomous systems and mobile devices.

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Area of Science:

  • Photonics and Sensor Technology
  • Machine Perception and Robotics

Background:

  • Three-dimensional (3D) imaging sensors are crucial for machine perception, but current Light Detection and Ranging (LiDAR) devices are often limited by mechanical scanners.
  • Existing focal plane array-based 3D sensors offer solid-state advantages but suffer from low resolutions, typically 512 pixels or less.

Purpose of the Study:

  • To develop a high-resolution, solid-state LiDAR sensor with a wide field of view and precise addressing capabilities.
  • To demonstrate the feasibility of a monolithic silicon photonic chip integrating a focal plane switch array (FPSA) for advanced 3D imaging.

Main Methods:

  • Development of a 128x128 element focal plane switch array (FPSA) integrating grating antennas and MEMS-actuated optical switches on a silicon photonic chip.
  • Experimental testing of a wire-bonded 128x96 subarray for 3D imaging.
  • Utilizing frequency-modulated continuous-wave (FMCW) ranging in a monostatic configuration for distance measurement.

Main Results:

  • Achieved a 16,384-pixel LiDAR with a 70°x70° field of view and 0.6°x0.6° addressing resolution.
  • Demonstrated a narrow beam divergence of 0.050°x0.049° and sub-MHz random-access beam addressing.
  • Attained a distance resolution of 1.7 cm for 3D imaging.

Conclusions:

  • The developed FPSA technology enables high-resolution, solid-state LiDAR with superior performance metrics.
  • Monolithic integration on silicon photonic chips and potential for mass production via CMOS foundries pave the way for ubiquitous 3D sensing.
  • This technology is poised to significantly impact autonomous vehicles, drones, robots, and smartphones.