Potential of TiN/GaN Heterostructures for Hot Carrier Generation and Collection
Blake S Simpkins1, Sergey I Maximenko1, Olga Baturina1
1Naval Research Laboratory, Washington, DC 22032, USA.
Nanomaterials (Basel, Switzerland)
|March 10, 2022
Summary
Titanium nitride (TiN) on gallium nitride (GaN) shows promise for plasmonic applications. Interfacial properties vary with GaN doping, impacting hot carrier collection for optimized device performance.
Area of Science:
- Materials Science
- Nanotechnology
- Solid-State Physics
Background:
- Plasmonic applications require materials with specific optical properties.
- Gallium nitride (GaN) is a semiconductor with potential for hot carrier applications.
- Interfacial properties between plasmonic materials and semiconductors are crucial for device efficiency.
Purpose of the Study:
- To investigate the optical properties of titanium nitride (TiN) sputter-deposited on GaN.
- To analyze the interfacial characteristics of TiN/GaN systems with different doping (p-type and n-type).
- To evaluate the suitability of these interfaces for plasmonically generated hot carrier collection.
Main Methods:
- Sputter deposition of TiN thin films onto GaN substrates.
- Characterization of optical properties of the TiN/GaN interfaces.
- Electrical measurements to determine interfacial properties, including Schottky barrier height.
Main Results:
- TiN on GaN exhibits desirable optical properties for plasmonic applications.
- A Schottky barrier of approximately 0.56 eV formed on p-type GaN, facilitating electron-hole separation.
- No significant transport barrier was observed for TiN on n-type GaN, allowing for bias-dependent carrier control.
Conclusions:
- The TiN/GaN system is a viable candidate for plasmonic devices utilizing hot carriers.
- Doping-dependent interfacial properties offer distinct advantages for carrier management in different applications.
- The choice between p-type and n-type GaN depends on the desired mechanism for hot carrier collection and utilization.
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