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Insertion Loss and Phase Compensation Using a Circular Slot Via-Hole in a Compact 5G Millimeter Wave (mmWave) Butler
Noorlindawaty Md Jizat1, Zubaida Yusoff1, Azah Syafiah Mohd Marzuki2
1Faculty of Engineering, Multimedia University, Cyberjaya 63100, Selangor, Malaysia.
Sensors (Basel, Switzerland)
|March 10, 2022
Summary
This study presents a compact beamforming Butler matrix (BM) for 5G mmWave systems. The novel dual-layer design minimizes losses and size, enhancing millimeter wave communication performance.
Area of Science:
- Electrical Engineering and Applied Physics
- Telecommunications
- Antenna Theory and Design
Background:
- Fifth-generation (5G) technology requires high data rates and low latency, utilizing millimeter wave (mmWave) frequencies.
- mmWave frequencies present propagation challenges like poor signal characteristics and material losses.
- Beamforming Butler matrices (BMs) are crucial for mitigating these mmWave challenges by controlling signal phase and amplitude.
Purpose of the Study:
- To design and develop a compact, low-loss Butler matrix suitable for 5G mmWave communication systems.
- To overcome the limitations of traditional planar BMs, such as intricate structures, insertion losses, and size constraints at mmWave frequencies.
Main Methods:
- Implemented a dual-layer substrate design connected via vias, arranging hybrid couplers side-by-side to eliminate crossover elements.
- Optimized the design of strip lines, hybrid couplers, and via-holes for each BM element.
- Fabricated and measured a Butler matrix with dimensions of 23.26 mm × 28.92 mm (2.17 λ0 × 2.69 λ0) operating at 28 GHz.
Main Results:
- Achieved return losses (S11 and S22) below -10 dB, indicating efficient signal matching.
- Measured transmission amplitude within the acceptable range of -8 ± 2 dB.
- Demonstrated an acceptable output phase response at the target 28 GHz frequency.
Conclusions:
- The proposed dual-layer Butler matrix effectively addresses the size and loss challenges of mmWave BMs for 5G applications.
- The compact and low-profile design is well-suited for integration into 5G mmWave communication systems, improving signal propagation and reducing path loss.
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