A Method for Prediction of Ultrasonic Detectability of Interface Gap Defects on TC4 Diffusion-Bonded Joints

An analysis method for the detectability of defects on the TC4 (Ti-6Al-4V) diffusion bonding interface was proposed in this study. First, a semi-analytical model of the liquid-solid coupling acoustic field with attenuation characteristics was constructed. Based on this, a method for the selection of transducer parameters was investigated for effective focus on the diffusion bonding interface. Second, according to the characteristics of defects on the diffusion bonding interface, an acoustic response model for diffusion bonding defects was established based on Kirchhoff approximation. The detectability of defects on the diffusion bonding interface was analyzed using transducers of different frequencies with different diffusion bonding interface gaps. Finally, an experiment was conducted to verify the reliability of the simulation. The analysis method proposed shows the advantages in the selection of suitable parameters for detecting specific diffusion bonding interface gaps, providing theoretical predictions of the detectability of diffusion bonding interface defects.