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On-Demand Programming of Liquid Metal-Composite Microstructures through Direct Ink Write 3D Printing.
Aaron Haake1, Ravi Tutika2,3, Gwyneth M Schloer2
1Department of Mechanical & Materials Engineering, Smart Materials & Robotics Lab, University of Nebraska-Lincoln, Lincoln, NE, 68588, USA.
Advanced Materials (Deerfield Beach, Fla.)
|March 30, 2022
Summary
Researchers developed a direct ink writing method to precisely control liquid metal (LM) microstructure in soft composites. This innovation enables on-demand programming of LM shape, orientation, and connectivity for advanced soft electronics and robotics.
Area of Science:
- Materials Science
- Soft Matter Physics
- Additive Manufacturing
Background:
- Soft, deformable composites with liquid metal (LM) droplets are crucial for soft electronics and robotics.
- Existing methods lack control over the local composite microstructure, limiting material properties and performance.
Purpose of the Study:
- To develop a technique for programming the LM microstructure within elastomer composites on demand.
- To demonstrate control over LM shape, orientation, and connectivity for tailored material properties.
Main Methods:
- A direct ink writing technique using emulsion inks with LM fillers was developed.
- In situ control of LM microstructure was achieved by manipulating printing process conditions.
- The technique allows for the creation of filaments, films, and 3D structures with programmable microstructures.
Main Results:
- Demonstrated on-demand programming of LM microstructure, including transitions from spherical to needle-like droplets and curvilinear patterns.
- Achieved control over the electrical conductivity of the composite materials, enabling locally insulating or conductive regions.
- Printed materials exhibit high softness (modulus < 200 kPa) and deformability (>600% strain).
Conclusions:
- The developed direct ink writing technique offers unprecedented control over LM microstructure in soft composites.
- Programmable microstructures enable new composite paradigms for technologies requiring mechanical compliance and multifunctionality.
- Applications include soft heat sinks for efficient thermal management in electronics.

