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Ultrathin TiN Epitaxial Films as Transparent Conductive Electrodes.

I Hong Ho1, Ching-Wen Chang2, Yen-Lin Chen1

  • 1Department of Photonics, College of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan.

ACS Applied Materials & Interfaces
|April 1, 2022
PubMed
Summary

Ultrathin titanium nitride (TiN) films, grown by plasma-assisted molecular-beam epitaxy, offer high transparency and conductivity. These properties make them ideal for next-generation transparent conductive electrodes.

Keywords:
THz spectroscopymolecular-beam epitaxyrefractory materialspectroscopic ellipsometrytitanium nitridetransparent conductive electrode

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Area of Science:

  • Materials Science
  • Condensed Matter Physics

Background:

  • Titanium nitride (TiN) exhibits high melting temperature, mechanical, and chemical stability.
  • Ultrathin TiN films offer high optical transmittance and electrical conductivity, making them potential alternatives to metal oxide electrodes.
  • Challenges exist in depositing ultrathin, continuous TiN films with smooth surfaces, as defects can limit performance.

Purpose of the Study:

  • To develop a method for growing ultrathin, continuous TiN films with excellent surface morphology and properties.
  • To investigate the optical, dielectric, and electrical characteristics of these films.

Main Methods:

  • Nitrogen plasma-assisted molecular-beam epitaxy (MBE) in an ultrahigh vacuum environment.
  • Spectroscopic ellipsometry for dielectric properties.
  • Terahertz spectroscopy and Hall effect measurements for electrical properties.

Main Results:

  • Achieved ultrathin TiN films (2-10 nm) with excellent surface morphology (RMS roughness ≤0.12 nm).
  • Attained high optical transparency (75% across the visible spectrum).
  • Determined a percolation thickness below 2.4 nm and high electrical conductivity (>1.1 × 10^4 Ω⁻¹ cm⁻¹).

Conclusions:

  • MBE-grown ultrathin TiN epitaxial films possess superior properties for transparent conductive electrode applications.
  • These films are robust, cost-effective, and suitable for large-area applications.
  • The developed method overcomes challenges in depositing high-quality ultrathin metallic layers.