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Single-chip hybrid integrated silicon photonics transmitter based on passive alignment
Optics Letters
|April 1, 2022
Summary
A novel single-chip hybrid integrated silicon photonics transmitter was developed using passive alignment flip-chip bonding. This transmitter achieved a 16.35 GHz bandwidth and successfully transmitted data at 25 Gbps.
Area of Science:
- Photonics
- Integrated Circuits
- Optical Communications
Background:
- Silicon photonics enables miniaturized optical devices.
- Hybrid integration combines different photonic components onto a single chip.
- Passive alignment flip-chip bonding offers a cost-effective manufacturing method.
Purpose of the Study:
- To demonstrate a single-chip hybrid integrated silicon photonics transmitter.
- To achieve high-speed data transmission using this integrated device.
Main Methods:
- Hybrid integration of a C-band slotted laser and a Mach-Zehnder modulator.
- Utilizing passive alignment flip-chip bonding technology.
- Characterization of small signal response and data transmission experiments.
Main Results:
- Demonstrated a hybrid integrated transmitter with a 1 mm cavity length laser and 2 mm phase shifter modulator.
- Achieved a 3 dB bandwidth of 16.35 GHz at 5.99 VPP with a 2.43 V reverse bias.
- Successfully performed 25 Gbps data transmission at 25°C.
Conclusions:
- The developed single-chip hybrid integrated silicon photonics transmitter is a viable solution for high-speed optical communication.
- Passive alignment flip-chip bonding is an effective technique for fabricating such integrated devices.
- The device shows promising performance for future optical networking applications.
