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Updated: Sep 27, 2025

Pool-Boiling Heat-Transfer Enhancement on Cylindrical Surfaces with Hybrid Wettable Patterns
Published on: April 10, 2017
A thermally conductive interface material with tremendous and reversible surface adhesion promises durable
Cong Guo1, Yuhan Li2, JianHua Xu3
1College of Polymer Science and Engineering, State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, P. R. China. kaiwu@scu.edu.cn.
Abstract:
The dramatic miniaturization and integration of electronic devices call for next-generation thermally conductive interface materials with higher service performance and long-term stability. In addition to enhancing the inherent thermal conductivity of materials, it is noteworthy to pay attention to the thermal contact resistance. Herein, we synthesized a polyurethane with hierarchical hydrogen bonding to realize high surface adhesion with substrates; another key was incorporating aluminum oxide modified by a deformable liquid metal to improve the thermo-conductive capability and offer the freedom of polymeric segmental motions. These molecular and structural designs endow the composite with high isotropic thermal conductivity, electrical insulation and temperature-responsive reversible adhesion, which enable low thermal resistance and durable thermal contact with substrates without the need for external pressure.
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