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Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting.

Ying Meng1,2, Runhua Gao1, Xinhua Wang1,2,3

  • 1High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.

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Summary

This study introduces a novel oxygen plasma and wetting method for polymer adhesive bonding in 3D integration. This technique overcomes misalignment issues, enabling rapid, low-temperature, void-less bonding of polyimides.

Keywords:
3D integrationhybrid bondinghydrophilicplasma activationpolyimide bonding

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Area of Science:

  • Materials Science
  • Surface Chemistry
  • Microelectronics Engineering

Background:

  • Polymer adhesives are crucial for dielectric passivation in 3D integration.
  • Challenges exist with polymer adhesive curing, leading to misalignment issues.
  • Need for advanced bonding techniques in microelectronics.

Purpose of the Study:

  • To develop a novel method for adhesive bonding of cured polyimides.
  • To address misalignment problems in hybrid bonding for 3D integration.
  • To optimize bonding parameters for enhanced performance and efficiency.

Main Methods:

  • Utilizing synergistic oxygen plasma surface activation and wetting.
  • Applying the process to completed cured polyimides.
  • Characterizing the surface modifications and bonding performance.

Main Results:

  • Achieved void-less bonding with a maximum shear strength of 35.3 MPa.
  • Optimized process operates at a low temperature of 250 °C and takes only 2 minutes.
  • Plasma activation creates hydrophilic groups, enhanced by wetting, facilitating interface bridging.

Conclusions:

  • The synergistic plasma activation and wetting method provides an effective solution for polyimide adhesive bonding.
  • This approach significantly reduces bonding time and thermal stress in 3D integration.
  • Offers a viable alternative for adhesive bonding in advanced microelectronic packaging.