Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Experiment Video

Updated: Sep 27, 2025

A Versatile Method of Patterning Proteins and Cells
09:57

A Versatile Method of Patterning Proteins and Cells

Published on: February 26, 2017

9.5K

Laser Direct Structured 3D Circuits on Silicone.

Byungseok Yoo1, David Bowen2, Nathan Lazarus3

  • 1Department of Aerospace Engineering, University of Maryland, College Park, Maryland 20742, United States.

ACS Applied Materials & Interfaces
|April 12, 2022
PubMed
Summary
This summary is machine-generated.

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Future scientific innovation requires the transformative power of philanthropy.

Proceedings of the National Academy of Sciences of the United States of America·2024
Same author

Self-Folding PCB Kirigami: Rapid Prototyping of 3D Electronics via Laser Cutting and Forming.

ACS applied materials & interfaces·2022
Same author

Towards enduring autonomous robots via embodied energy.

Nature·2022
Same author

Hand Gesture Recognition Using EGaIn-Silicone Soft Sensors.

Sensors (Basel, Switzerland)·2021
Same author

Mechanically Cloaked Multiphase Magnetic Elastomer Soft Composites for Wearable Wireless Power Transfer.

ACS applied materials & interfaces·2020
Same author

Ultrafine Pitch Stencil Printing of Liquid Metal Alloys.

ACS applied materials & interfaces·2017
Same journal

Removal of Codispersible Residual Impurities from CuInS<sub>2</sub>/ZnS Quantum Dots for Window-Replaceable Luminescent Solar Concentrators.

ACS applied materials & interfaces·2026
Same journal

Durable Core-Shell Scatterer Coating with Heat Storage for Radiative Cooling.

ACS applied materials & interfaces·2026
Same journal

Calix[6]arene-Based Interlocked Inverse Vulcanizate Enabling Network-Interface Cooperative Reinforcement in Natural Rubber/Carbon Black Composites.

ACS applied materials & interfaces·2026
Same journal

Resolving Thermal Accumulation and Rigid-Soft Interface Mismatch in Stretchable Electronics with Cubic Boron Nitride Composite Islands.

ACS applied materials & interfaces·2026
Same journal

Enhancing Conversion Reversibility and Initial Coulombic Efficiency of SnO<sub>2</sub> Anodes via NiO/Ni-Carbon Interfacial Design.

ACS applied materials & interfaces·2026
Same journal

Multidimensional Interface Structure Design for High-Efficiency Optically Controlled Semiconductor Devices: A Case Study on Memristive Synapses.

ACS applied materials & interfaces·2026
See all related articles

Researchers integrated electrical circuits into flexible silicone using laser direct structuring. This method enhances conductivity and adhesion for advanced mechanical and biologic sensing applications.

Area of Science:

  • Materials Science
  • Polymer Chemistry
  • Electrical Engineering

Background:

  • Silicone rubber's biocompatibility and flexibility offer potential for mechanical and biologic sensing.
  • Reliable integration of electrical circuits into silicone is crucial for these applications.
  • Laser direct structuring presents a promising bottom-up approach for circuit fabrication on polymer substrates.

Purpose of the Study:

  • To demonstrate the feasibility of laser direct structuring for fabricating electrical circuits on superflexible silicone.
  • To investigate the influence of copper chromite concentration and laser power on circuit properties.
  • To evaluate the mechanical performance and adhesion of the fabricated circuits.

Main Methods:

  • Utilizing laser direct structuring to grow copper on laser-exposed, roughened regions of silicone with copper chromite additive.
Keywords:
copper chromite additiveelastomeric 3D circuitsflexible inductorslaser direct structuringsiliconesilicone adhesion

More Related Videos

Micro-masonry for 3D Additive Micromanufacturing
08:45

Micro-masonry for 3D Additive Micromanufacturing

Published on: August 1, 2014

10.5K
Fabrication Process of Silicone-based Dielectric Elastomer Actuators
10:32

Fabrication Process of Silicone-based Dielectric Elastomer Actuators

Published on: February 1, 2016

34.0K

Related Experiment Videos

Last Updated: Sep 27, 2025

A Versatile Method of Patterning Proteins and Cells
09:57

A Versatile Method of Patterning Proteins and Cells

Published on: February 26, 2017

9.5K
Micro-masonry for 3D Additive Micromanufacturing
08:45

Micro-masonry for 3D Additive Micromanufacturing

Published on: August 1, 2014

10.5K
Fabrication Process of Silicone-based Dielectric Elastomer Actuators
10:32

Fabrication Process of Silicone-based Dielectric Elastomer Actuators

Published on: February 1, 2016

34.0K
  • Fabricating various circuit patterns, including horseshoe, meander, Hilbert fractal inductors, and 3D helical traces on 2D and 3D substrates.
  • Conducting mechanical testing to assess breakage strain and elastic modulus, and measuring trace peel strength.
  • Main Results:

    • Successfully fabricated conductive copper circuits on superflexible silicone (Shore 00-30) with a copper chromite additive.
    • Demonstrated increased material stiffness and trace peel strength with higher copper chromite concentrations, reaching 1-5 kN/m.
    • Achieved high adhesion and conductivity, enabling high-quality circuit integration.

    Conclusions:

    • Laser direct structuring is an effective method for integrating high-quality electrical circuits into biocompatible silicone.
    • The process allows for the fabrication of complex circuit designs on both planar and contoured surfaces.
    • The enhanced mechanical properties and adhesion make this technique suitable for advanced sensing applications.