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Irreversible, Self-Aligned Microfluidic Packaging for Chronic Implant Applications.

Emily Szabo1, Allison Hess-Dunning1,2,3

  • 1Case Western Reserve University, Cleveland, OH 44106, USA.

Journal of Micromechanics and Microengineering : Structures, Devices, and Systems
|April 18, 2022
PubMed
Summary

A new microfluidic connector and thermal bonding method were developed for biomedical implants. This robust packaging is compatible with novel materials and suitable for chronic implant applications.

Keywords:
connectormicrofluidicneural interfacespackaging

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Area of Science:

  • Biomedical Engineering
  • Materials Science
  • Implantable Devices

Background:

  • Packaging is crucial for microfluidic devices in biomedical implants.
  • Reliable connectors are essential for microfluidic interfaces in chronic implants.
  • Current methods are incompatible with advanced polymeric materials for tissue integration.

Purpose of the Study:

  • To develop a microfluidic connector scheme compatible with novel materials.
  • To create a robust packaging solution for biomedical implant applications.
  • To assess the performance of the new connector and bonding method for chronic implants.

Main Methods:

  • Additive manufacturing was used to print connectors and adhesive wax.
  • A low-temperature thermal bonding process was employed.
  • Tensile and shear bond strengths of the interface were measured after 4 weeks of soak testing.

Main Results:

  • The packaging method demonstrated compatibility with novel polymeric materials.
  • Bond strength exceeded the force required for fluid infusion after 4 weeks.
  • Shear bond strength was at least 10-fold greater than typical probe insertion forces.

Conclusions:

  • The developed connector and thermal bonding method offer a viable solution for chronic implant applications.
  • This packaging approach enhances device integration with surrounding tissues.
  • The robustness of the packaging supports long-term performance in biomedical implants.