In situ polymerization of graphene-polyaniline@polyimide composite films with high EMI shielding and electrical
Kui Cheng1, Haoliang Li1, Mohan Zhu1
1School of Material Science and Engineering, University of Shanghai for Science and Technology Shanghai 200093 China lihl1989@outlook.com jhyang@usst.edu.cn.
Abstract:
With the increasing demands of the electronics industry, electromagnetic interference (EMI) shielding has become a critical issue that severely restricts the application of devices. In this work, we have proposed a "non-covalent welding" method to fabricate graphene-polyaniline (Gr-PANI) composite fillers. The Gr sheets are welded with PANI via π-π non-covalent interactions. Furthermore, a flexible polyimide (PI) composite film with superior EMI shielding effectiveness is prepared by in situ polymerization. The 40% content of Gr-PANI10:1 (the mass ratio of Gr to PANI is 10 : 1) shows a superior electrical conductivity (σ) as high as 2.1 ± 0.1 S cm-1, 1.45 times higher than that of Gr@PI film at the same loading. Moreover, the total shielding effectiveness (SET) of EMI of the Gr-PANI10:1@PI reaches ∼21.3 dB and an extremely high specific shielding effectiveness value (SSE) of 4096.2 dB cm2 g-1 is achieved. Such a "non-covalent welding" approach provides a facile strategy to prepare high-performance PI-based materials for efficient EMI shielding.
