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PCA-based sub-surface structure and defect analysis for germanium-on-nothing using nanoscale surface topography.

Jaewoo Jeong1,2, Taeyeong Kim1,2, Bong Jae Lee1,2

  • 1Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, South Korea.

Scientific Reports
|May 3, 2022
PubMed
Summary

A new method uses surface images to inspect buried germanium structures, improving speed and accuracy for microelectronics and sensors. This technique overcomes limitations of current 3D imaging for empty space in germanium (ESG) and germanium-on-nothing (GON) devices.

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Semiconductor Physics

Background:

  • Empty space in germanium (ESG) and germanium-on-nothing (GON) are self-assembled germanium structures with complex internal cavities.
  • These structures have potential applications in microelectronics, optoelectronics, and sensors due to their unique properties and fabrication ease.
  • Inspecting the buried sub-surface structures of ESG and GON is challenging with current non-destructive methods like ultrasonic atomic force microscopy and interferometry, which are slow and have thickness limitations.

Purpose of the Study:

  • To develop a novel, high-throughput, and robust methodology for inspecting buried sub-surface structures in germanium.
  • To overcome the limitations of slow measurement speeds and limited measurable thickness associated with conventional non-destructive characterization techniques.
  • To enable accurate defect detection and quantitative analysis of surface and sub-surface features in GON devices.

Main Methods:

  • Constructed a principal component analysis (PCA)-based database correlating surface images with empirically determined sub-surface structures.
  • Developed a method to determine buried sub-surface morphology solely from surface topography using the PCA database.
  • Utilized empirical destructive testing to address measurable thickness limitations.
  • Applied the methodology to germanium-on-nothing (GON) devices for defect analysis.

Main Results:

  • The proposed methodology significantly improves inspection throughput compared to existing 3D sub-surface analysis techniques.
  • Surface topography analysis accurately predicts sub-surface structure morphology.
  • The method demonstrated practicality in detecting and quantifying surface defects in GON devices.
  • Achieved fast, robust, and high-resolution sub-surface analysis.

Conclusions:

  • The developed methodology offers a faster and more efficient alternative to conventional sub-surface inspection schemes for germanium structures.
  • This approach provides a tunable and practical solution for defect detection and analysis in applications like micro-/nanoelectronics and optoelectronics.
  • The PCA-based correlation of surface images with sub-surface structures represents a significant advancement in non-destructive characterization.