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Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
Levi M J Moore1, Jacob J Zavala2, Jason T Lamb2
1Air Force Research Laboratory, Aerospace Systems Directorate, Edwards AFB California 93524 USA levi.moore.1@us.af.mil kamran.ghiassi@us.af.mil.
RSC Advances
|May 11, 2022
Summary
New bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) materials were synthesized and thermally cured. These crosslinked bis-PE-POSS compounds exhibit high thermal stability, decomposing near 600 °C.
Area of Science:
- Materials Science
- Polymer Chemistry
- Nanotechnology
Background:
- Polyhedral oligomeric silsesquioxanes (POSS) are hybrid organic-inorganic nanostructures.
- Functionalized POSS compounds offer tunable properties for advanced materials.
Purpose of the Study:
- To synthesize novel bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds.
- To investigate the thermal curing behavior and properties of the resulting crosslinked materials.
Main Methods:
- Synthesis of bis-PE-POSS via condensation of phenylethynyl-functional dichlorosilane with tetrasilanol phenyl POSS.
- Thermal curing of the synthesized compounds at 370 °C.
- Thermal decomposition analysis under nitrogen atmosphere.
Main Results:
- Successful synthesis of bis-PE-POSS compounds, yielding two geometric isomers.
- Formation of crosslinked materials upon thermal curing.
- High thermal stability observed, with decomposition onset near 600 °C under nitrogen.
Conclusions:
- The synthesized bis-PE-POSS compounds can be effectively crosslinked to form thermally stable materials.
- These materials demonstrate potential for high-temperature applications due to their inherent thermal resistance.
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