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Bis-phenylethynyl polyhedral oligomeric silsesquioxanes: new high-temperature, processable thermosetting materials
Levi M J Moore1, Jacob J Zavala2, Jason T Lamb2
1Air Force Research Laboratory, Aerospace Systems Directorate, Edwards AFB California 93524 USA levi.moore.1@us.af.mil kamran.ghiassi@us.af.mil.
Abstract:
Bis-phenylethynyl polyhedral oligomeric silsesquioxane (bis-PE-POSS) compounds were synthesized and thermally cured yielding crosslinked materials. After curing at 370 °C, thermal decomposition occurs near 600 °C under nitrogen. These materials were synthesized by condensation of a new phenylethynyl-functional dichlorosilane onto tetrasilanol phenyl POSS, yielding two geometric isomers.
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