Laser direct structuring and electroless plating applicable super-engineering plastic PPS based thermal conductive...

Area of Science:

• Materials Science
• Polymer Science
• Nanotechnology

Background:

• Boron nitride (BN) and laser-activated particles (LAPs) were investigated as fillers for polymer matrices.
• Poor interfacial adhesion between unmodified fillers and polyphenylene sulfide (PPS) matrix led to mechanical property deterioration.
• Surface modification strategies were employed to enhance filler-polymer compatibility.

Purpose of the Study:

• To improve the interfacial affinity of BN and LAPs for a PPS matrix through surface modification.
• To evaluate the impact of modified BN and LAPs on the thermal and mechanical properties of PPS composites.
• To explore the potential of BN/LAP/PPS composites for fabricating circuit boards via laser direct structuring (LDS).

Main Methods:

• Surface modification of BN and LAPs using base treatment and a silane coupling agent.
• Fabrication of polymer composites with modified and unmodified fillers.
• Characterization of mechanical properties (e.g., tensile strength) and thermal properties.
• Laser direct structuring (LDS) and electroless plating for circuit board fabrication.

Main Results:

• Surface modification enhanced thermal and mechanical properties compared to unmodified fillers, but tensile strength remained below neat PPS.
• The BN/LAP binary filler system had minimal impact on mechanical properties.
• Incorporating a small amount of LAP into BN composites slightly improved thermal conductivity.
• Laser-activated particles facilitated metal plating on laser-irradiated surfaces.

Conclusions:

• Surface-modified BN and LAPs can be utilized as functional fillers in PPS composites.
• The BN/LAP/PPS composite system is suitable for fabricating circuit boards using LDS and electroless plating.
• This approach holds potential for applications in light-emitting diodes (LEDs).