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Laser direct structuring and electroless plating applicable super-engineering plastic PPS based thermal conductive

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Surface modification of boron nitride (BN) and laser-activated particles (LAPs) improved polymer composites. BN/LAP/PPS composites enabled circuit board fabrication for light-emitting diode (LED) applications.

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Area of Science:

  • Materials Science
  • Polymer Science
  • Nanotechnology

Background:

  • Boron nitride (BN) and laser-activated particles (LAPs) were investigated as fillers for polymer matrices.
  • Poor interfacial adhesion between unmodified fillers and polyphenylene sulfide (PPS) matrix led to mechanical property deterioration.
  • Surface modification strategies were employed to enhance filler-polymer compatibility.

Purpose of the Study:

  • To improve the interfacial affinity of BN and LAPs for a PPS matrix through surface modification.
  • To evaluate the impact of modified BN and LAPs on the thermal and mechanical properties of PPS composites.
  • To explore the potential of BN/LAP/PPS composites for fabricating circuit boards via laser direct structuring (LDS).

Main Methods:

  • Surface modification of BN and LAPs using base treatment and a silane coupling agent.
  • Fabrication of polymer composites with modified and unmodified fillers.
  • Characterization of mechanical properties (e.g., tensile strength) and thermal properties.
  • Laser direct structuring (LDS) and electroless plating for circuit board fabrication.

Main Results:

  • Surface modification enhanced thermal and mechanical properties compared to unmodified fillers, but tensile strength remained below neat PPS.
  • The BN/LAP binary filler system had minimal impact on mechanical properties.
  • Incorporating a small amount of LAP into BN composites slightly improved thermal conductivity.
  • Laser-activated particles facilitated metal plating on laser-irradiated surfaces.

Conclusions:

  • Surface-modified BN and LAPs can be utilized as functional fillers in PPS composites.
  • The BN/LAP/PPS composite system is suitable for fabricating circuit boards using LDS and electroless plating.
  • This approach holds potential for applications in light-emitting diodes (LEDs).