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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh
Published on: June 23, 2017
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Fabrication of air-stable, transparent Cu grid electrodes by etching through a PVA-based protecting layer patterned
H Tokuhisa1, S Tsukamoto1, T Nobeshima1
1Flexible Electronics Research Center, National Institute of Advanced Industrial Science and Technology Tsukuba Ibaraki Japan h-tokuhisa@aist.go.jp.
RSC Advances
|May 11, 2022
Summary
A new transparent copper (Cu) grid electrode, fabricated using a polyvinyl alcohol (PVA) protective layer, offers a promising alternative to indium-tin-oxide (ITO). This flexible electrode demonstrates excellent transparency and conductivity, with enhanced oxidation resistance.
Area of Science:
- Materials Science
- Nanotechnology
- Electrochemistry
Background:
- Indium-tin-oxide (ITO) is the conventional transparent conductive electrode, but it suffers from brittleness and high cost.
- Developing flexible and cost-effective alternatives to ITO is crucial for next-generation electronic devices.
Purpose of the Study:
- To fabricate a transparent copper (Cu) grid electrode on a flexible substrate as an alternative to ITO.
- To evaluate the optical and electrical properties of the fabricated Cu grid electrode.
- To investigate the oxidation resistance of the Cu grid electrode.
Main Methods:
- Fabrication of a transparent Cu grid electrode on a flexible polyethylene naphthalate (PEN) film.
- Utilizing a polyvinyl alcohol (PVA)-based protecting layer for masking during etching.
- Generating PVA patterns via controlled evaporation of an aqueous solution using a screen mesh template.
- Etching the Cu film with a FeCl3 methanolic solution to form the grid electrode.
- Characterizing the transparency, conductivity, and oxidation resistance of the Cu grid electrode.
Main Results:
- A transparent Cu grid electrode was successfully fabricated on a flexible PEN film.
- The Cu grid electrode exhibited a transparency of 87.2 ± 5.2% at 550 nm and sheet resistance of 6.1 ± 5.3 Ω/□.
- The performance is comparable or superior to conventional ITO electrodes.
- The PVA coating significantly enhanced the oxidation resistance of the Cu grid electrode.
Conclusions:
- A flexible, transparent Cu grid electrode can be fabricated using a PVA-based protective layer and etching process.
- The developed Cu grid electrode presents a viable and potentially superior alternative to ITO for flexible electronics.
- The PVA coating effectively improves the durability and stability of the Cu grid electrode by enhancing oxidation resistance.
