Unequal bonding in Ag-CuIn3Se5-based solid solutions responsible for reduction in lattice thermal conductivity and

Jiaolin Cui1, Yufu Lu1,2, Shaoping Chen2

  • 1School of Materials & Engineering, Ningbo University of Technology Ningbo 315016 China cuijiaolin@163.com.

RSC Advances
|May 11, 2022
PubMed

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