A Dynamic Thermal-Mechanical Coupling Numerical Model to Solve the Deformation and Thermal Diffusion of Plates

Wenxing Chen1, Shuyang Dai1,2, Baojuan Zheng3

  • 1School of Mathematics and Statistics, Wuhan University, Wuhan 430072, China.

Micromachines
|May 28, 2022
PubMed

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